Peltier cooler, peltier device, thermoelectric module (TEC) leverage their core advantages of being fully solid-state, vibration-free, with millisecond response time, ±0.01℃ precise temperature control, and bidirectional thermal management, becoming a key solution for precise temperature control, local heat dissipation, and extreme environment thermal management in high-tech fields. They cover core sectors such as optical communication, 5G, and data centers.
1. Optical Communication and 5G / Data Centers (Core Must-Need Scenarios)
Micro TEC ,micro thermoelectric module, micro peltier module for DFB/EML laser chips and detectors: Provide ±0.1℃ constant temperature to suppress wavelength drift and ensure stable long-distance/high-speed (400G/800G) optical signals; single module power consumption < 1W, response < 10ms.
5G base station power amplifiers / RF: Local heat dissipation for GaN power amplifiers and phased array antennas. One piece 40mm×40mm TEC module ,thermoelectric module (peltier cooler) can reduce the junction temperature by 22℃ at a 80W heat load, improving system reliability by 30%.
Data center optical interconnection: Temperature control for high-density rack-mounted optical modules, replacing liquid cooling to address local hotspots and space constraints.
II. Semiconductor Manufacturing and Advanced Packaging (High Precision Process Assurance)
Lithography / Adhesive Application / Development: The application of photoresist, temperature control of CMP polishing fluid, with fluctuations kept within **±0.1℃**, to prevent chip deformation and surface roughness exceeding standards due to thermal stress.
Wafer Testing / Aging: Precise temperature control of the aging test bench and probe station, ensuring stable yield rate. Domestic equipment has achieved import substitution.
Advanced Packaging (3D/Chiplet): Local heat dissipation and thermal balance between stacked chips to solve the problem of thermal mismatch in heterogeneous materials.
III. Medicine and Life Sciences (Precise Temperature Control + Rapid Temperature Variation)
PCR / Genetic Sequencing: Rapid temperature rise and drop (-20℃~105℃), temperature control accuracy ±0.3℃. This is the core temperature control unit for nucleic acid amplification and DNA sequencing.
Medical Imaging (CT/MRI/Ultrasound): Local cooling of X-ray tubes, superconducting magnets, and constant temperature of ultrasound probes, improving tube voltage stability to 99.5%, and extending continuous working time.
Biological Samples / Vaccine Storage: Wide temperature range (-80℃~200℃), vibration-free storage, suitable for mRNA vaccines, stem cells, and protein samples for cold chain and laboratory preservation.
Surgical Instruments / Low-Temperature Therapy: Temperature control of minimally invasive surgical instruments, low-temperature plasma / cryotherapy equipment, achieving precise local cooling.
IV. Laser and Infrared Optoelectronics (Beam Quality + Detection Sensitivity)
Industrial/Research Lasers: Fiber, Solid State, Ultrafast Laser Resonators / Gain Medium Constant Temperature, Beam Quality M² Fluctuation < ±0.02, Wavelength Stability < 0.1nm.
Infrared Detectors (Cooled Type): InGaAs, MCT Detectors Deep Cooling (190K – 250K), Enhance Infrared Imaging / Remote Sensing Sensitivity, Used for Security, Astronomy, Military Reconnaissance.
Lidar (LiDAR): Automotive Grade / Industrial Grade Lidar Transmitter / Receiver Modules Temperature Control, Adapt to Extreme Environments of -40°C to 85°C, Ensure Measurement Distance Accuracy.
V. Aerospace and Defense (Extreme Environments + High Reliability)
Satellites/Aircraft: On-board cameras, communication payloads, inertial navigation systems with temperature control, capable of withstanding vacuum, extreme temperature variations (-180°C to 120°C), without moving parts, with a lifespan of over 100,000 hours.
Airborne/Shipborne Electronics: Radios, communications, fire control equipment cooling, resistant to vibration and impact, meeting military-grade reliability requirements.
Deep Space Exploration: Instrument compartments for Mars rovers and lunar rovers with thermal management, using thermoelectric cooling module, thermoelectric module, peltier device, peltier element, TEC module for bidirectional temperature control to achieve day-night temperature balance.
VI. New Energy Vehicles and Intelligent Cockpit (Thermal Management Upgrade)
Battery Pack: Precise local temperature control for cells/modules (25℃ ± 2℃), enhancing fast charging efficiency, cycle life, and low-temperature discharge performance.
Intelligent Cockpit: OLED/Mini LED center screens, AR HUD backlighting with constant temperature control (<35℃), preventing screen burn-in and improving color accuracy; BYD Haolei Ultra has integrated ultra-thin TEC array (1.2mm thick).
Vehicle Laser Radar / Domain Controller: High-performance computing chips, sensor heat dissipation, ensuring stable perception and decision-making for autonomous driving.
VII. High-end Electronics and Precision Instruments (Local Hotspots + No Vibration)
High-performance computing (HPC/AI): Local heat dissipation for GPU/CPU, ASIC chips, addressing the hotspot concentration in 3D packaging and Chiplet, with temperature control accuracy of **±0.1℃**.
Precise measurement / optical instruments: Interferometer, high-precision microscope, spectrometer temperature control, eliminating temperature drift, measurement accuracy reaching nanometer level.
Wearable / AR/VR: Micro thermoelectric cooling module, thermoelectric module ,Micro peltier module, Micro TEC for headsets, smart watches for local heat dissipation and human body temperature control, enhancing wearing comfort.
VIII. Other Cutting-edge Scenarios
Quantum computing / Superconductivity: Quantum bits, superconducting chips with low-temperature (mK to K range) auxiliary temperature control to suppress thermal noise.
New energy (photovoltaic / energy storage): Cooling of photovoltaic module backsheet, heat dissipation of energy storage converter (PCS), improving conversion efficiency.
Microfluidics / Chip Laboratory: Precise temperature control of microchannels and reaction chambers, used for chemical synthesis and drug screening.
Core technical advantages (key for adapting to advanced scenarios)
All-solid-state: No compressor, no refrigerant, no vibration, low noise, suitable for precision / clean environments.
Precise bidirectional: One-click switching between cooling and heating, temperature control accuracy of ±0.01℃, response time < 10ms.
Miniaturization: Minimum size of 1×1mm, thickness < 0.5mm, suitable for high-density integration.
High reliability: No mechanical wear, lifespan > 100,000 hours, adaptable to extreme temperature and humidity and vibration environments.
Post time: Feb-17-2026
